Thermally Conductive Silicone Grease
Silapast HS-200 is a non-reactive, silicone, thermally conductive grease designed to facilitate heat transfer away from electrical/electronic components.
This material is thickened with heat conductive metal oxide filler to maintain a positive heat sink seal in electrical/electronic equipment.
Silapast HS-200 is ideally suited for use in thin cross-sectional thickness down to < 1 mm.
Key Features and Benefits
Excellent conductivity
Noncorrosive
Stable from -40°C to +150°C
High dielectric strength
Thin Bondlines to < 1 mm.
Easy to Apply by Dispensing or Printing
Reworkable/Easy to Remove
Nonflammable
Alcohol Cleanability
Low Bleed
High Volume Resistivity
Potential Uses
It can be used with a variety of emerging and standard devices including CPU, PPGA, BGA, microBGA, DSP and graphic accelerator components.
Other device applications include power transistors, diodes, and silicon-controlled rectifiers.
Typical Properties
Color : White
Specific Gravity: 2.10
Bleed (24 Hours, 150°C): Nil
Temperature Range (°C): -40 to 150
Thermal Conductivity (W/m°C): 0.7
Dielectric Constant (25°C, 1kHz): 4.0
Dissipation Factor (25°C, 1kHz): 0.008
Volume Resistivity, (ohm-cm): 2 x 1015
Compatibility
Silapast HS-200 is generally compatible with most materials used in printed circuit board fabrication. As with any silicone compound, compatibility with substrate must be determined prior to use.
Good compatibility with: ceramic, clean metals, glass, natural fibers, silicone resins, painted surfaces, plastic surfaces, synthetic fibers, vulcanized silicone rubber, wood.