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These systems are built with no prior knowledge of the characteristics of the application that is going to use the system. The system is composed of FPGA chips connected together through Field Programmable Inter-Connect chips FPICs [12]. One of the approaches is to mount the FPGAs and FPICs on one MCM substrate.
The main advantage of this model is that larger systems can be implemented but it suffers from high cost and low clock performance due to the lack of system optimization and due to the use of programmable interconnections between FPGAs.
Jamil Khatib
1998-10-16