Terms, Shortenings and Definition

Best viewed at 17" Display.

Terms, Shortenings and Definition:
Connector=Conn.; Contact=cont.; Printed Cirquit Board=PCB;
Straight PCB = STR PCB = Parrallel = Sandwich = PiggiBack;
Right Angle PCB = RA PCB=Perpendicular = Normal = "T" = RA PCB = Angled PCB;
Backplane = Backpanel = Mainboard = Motherboard; Extender Card = Card; Application = Appl.; Manufacturer Part Number = p/n;
High Frequency=HF;

Connector is always works with it Mating Spouse! (Mating Conn.)
Gender of Conn. MALE or FEMALE are defined generally by Gender of their Contacts.
Gender of Conn. body mostly is opposite to Gender of contacts.
Types of Conn.are defined by Mechanical and Electrical properties, Physical Configurations and Dimensions.
Conn. divided to different Families by Type. Every Type/Family has a Generic Name.

All Info for Preliminary use ONLY!

Electric Current:
For Data - milliAmperes-1A DC; milliVolts-90/45 Volt DC; Rate 0-30/50 MHZ and more DC; For HF - Rate MHz and Up; For Power - AC: 240/110V, 5-100A; DC: high(12-50V, 10-50A) and low(1.2-24V, 3-10A); Physical Configuration of Connection:
Device-to-Device (Cable-to-Device)
Board-to-Board (Perpendicular = Normal = "T" = Right Angle = RA PCB or Straight = STR PCB = Parrallel = "Sandwich" = "PiggiBack")
Cable-to-Board (Cable-to-Rack, Cable-to-Cable="Free Hang").



				SMT / Socket Acronyms Glossary.

ASTM		American Society for Testing Materials.
BGA		Ball Grid Array
CLCC		Ceramic Leaded Chip Carrier
CQFP		Ceramic Quad Flat Pack
DIMM		Dual In-Line Memory Module
DIP		Dual In-Line Package
DPM		Defect Per Million
DRAM		Dynamic Random Access Memory
EIA		Electronic Industries Association
EMC		Electromagnetic Compatibility
EMI		Electromagnetic Interference
EPROM		Electrically Programmable Read Only Memory
FP		Fine Pitch
HASL		Hot Air Solder Leveling
IPC		Institute for Interconnecting and Packaging Electronic Circuits
IR		Infra Red
JEDEC		Joint Electronic Device Engineering Council
LCC		Leadless Chip Carrier
LCCC 		Leadless Ceramic Chip Carrier
MEPPE		Microelectronic Packaging and Processing Engineers
MLCC		Metal Leaded Chip Carrier
MQFP		Metric Quad Flat Pack
MTBF		Mean Time Between Failure
MTTF 		Mean Time To Failure
PBGA		Packaged Ball Grid Array
PCB		Printed Circuit Board
PCMCIA		Personal Computer Memory Card Association
PGA		Pin Grid Array
PLCC		Plastic Leaded Chip Carrier
PQFP		Plastic Quad Flat Pack
PSOP		Power Small Outline Package
PTH		Plated Through Hole
SMC		Surface Mount Component
SMD		Surface Mount Device
SMT		Surface Mount Technology
SOJ		Small Outline J Leads
SOP		Small Outline Package
SPOT		Solder Paste-on-Through-Hole
SQFP		Shrink Quad Flat Pack
SSOP		Shrink Small Outline Package
TCP		Tape Carrier Package
TQFP		Thin Quad Flat Pack
TSOP		Thin Small Outline Package
VSOP		Very Small Outline Package
ZIF		Zero Insertion Force

Back to Home Mail Conn. Family Tree Choice Application Connector Theory Privacy Policy