Connector Technology Info

Connector Technology Info.

Connector Technology List

PCB - Printed Cirquit Board Mounting Technology

Cable/Wire Assembly Technology.

Soldering (eyelet), Soldering (solder Cup).

Wire Wrapp

Single Wire Crimping

Good Connector shall has an Approval Standards, such as UL, CSA, ISO.

General:
A Good Contact shall be plated AFTER Raw Metal Strip Cutting,
and shall has All Surfaces Plated. CHECK IT!
The Plating Thickness is define a Number of Mating Cycles.
The Plating Thickness be measured by the Thickness of External Plating Layer,
but Internal Layers Thicknesses are significant for Working Life Time (Include Stock Shelf Life).
The Porosity - quality of Plating is a vitaly for Working Life Time.
The Porosity is not listed in a Connector Specifications,
but a Good Manufacturer make a Plating with Low Porosity.
Gold Plated Contact non Allowed with Tin Plated and Opposite.
Structure of Plating:
Gold(Au) or Palladium(Pd) or Tin (Sn) or Tin-Lead (SnPb - better for Long-Life) over Nickel(Ni) over Base Metal(Brass or ?).

Mating Contact Plating is defined by a System and Connection Application.

Application	Simple Toy	Home/Desktop Equipment	Communication Equipment	Military or Test Equipment
Mating Contact Plating	Flash Gold(5-10 Microinch Gold) or Tin	15-30 Microinch Gold over Ni.	30 Microinch Gold over 50-80 Microinch Ni.	50-100 Microinch Gold over 80-150 Microinch Ni.
Number of MatingCycles	20-50	100-200	250	500
Working LifeTime	up to 3	5-7	10-20	"Forever"
Performance Level per DIN 41612 part 5	-	3	2	1

PCB or Wire mounting Tail (Leg) Plating mostly is a Tin (Sn) or Tin-Lead (SnPb), Thickness 20-150 Microinch.
Metal Shell and Accessories Plating mostly is a Yellow Crom (Cr) or Nickel(Ni)
or Tin (Sn) or Tin-Lead (SnPb), Thickness 20-150 Microinch.
1 Micrometer ~= 40 Microinch
1 Microinch ~= 0.025 Micrometer