Publications
1.
Gu, Y.
and Nakamura, T., “Interfacial delamination and fatigue life estimation
of 3D solder bumps in flip-chip packages”, Microelectronics
Reliability, Vol. 44, pp 471-483, 2004.
2.
Gu, Y.,
Nakamura, T., Prchlik, L., Sampath, S., and Wallace, J., “Micro-indentation
and inverse analysis to characterize elastic-plastic graded materials”,
Materials Science and Engineering A, Vol. 345, pp 223-233, 2003.
3.
Gu, Y.,
Nakamura, T., Chen, W., and Cotterell, B., “Interfacial delamination
near solder bumps and UBM in flip-chip packages”, ASME Journal of
Electronic Packaging, Vol. 123, pp 295-301, 2001.
4.
Gu, Y.,
Nakamura, T., and Sampath, S., “Determination of anisotropic parameters
using instrumented nano indentation and inverse analysis”, submitted to Mechanics
of Materials.
5.
Li, L, Gouldstone, A., Kharas, B., Gu, Y. and Sampath, S.
“Nano-mechanics of small-volume thermal spray deposits on substrates”,
MRS Spring Meeting,
San Francisco, California, April 2004.
6.
Nakamura, T. and Gu, Y. “Measurements
of elastic-plastic anisotropic properties of thermally sprayed coatings
using nano-indenters and inverse analysis technique”,
International Thermal Spray Conference & Exposium, Japan, May
2004.
7.
Gu, Y.
and Nakamura, T., “Determination of
anisotropic properties using nano-indentation and inverse technique”, ASME
IMECE, Washington, D.C., Nov. 2003.
8.
Nakamura, T., Gu, Y., and Kushner, A., “Study of the
stress and deformation in acme nut threads”, final report for National
Transportation Safety Board, Sept. 2002.
9.
Gu, Y.,
Nakamura, T., Prchlik, L., and Sampath, S.,
“Inverse analysis and instrumented indentation to determine FGM
parameters”, ASME IMECE, New Orleans, Nov. 2002.
10.
Gu, Y.,
Nakamura, T., Prchlik, L., and Sampath, S.,
“Inverse method and indentation to measure material parameters”, Society
of Experimental Mechanics (SEM) Graduate Student Symposium,
Stony Brook, May 2002.
11. Gu, Y. and Nakamura, T., “3D interfacial delamination near solder bumps in flip-chip package”, ASME IMECE, New York, Nov. 2001.
12. Nakamura, T., Gu, Y., Chen, W., and Cotterell, B., “Deformation and failure of multi-layered under-bump-metallurgy in flip-chip packages”, ASME IMECE, Nashville, Nov. 1999
