Research

I.   Electronics Packaging

Aimed at understanding the failure mechanism by identifying likely fracture modes and potential delamination sites in flip chip packages. Multi-scale (global/local) finite element method were developed and applied. Detailed 2D and 3D fracture/fatigue analyses were carried out. 

 

Flip-Chip Packaging

 

 

 

 

 

 

 

II.   Materials Characterization

Inverse analysis procedures were developed based on micro/nano indentions and Kalman filter technique. Methods successfully applied to the characterization of metal-ceramic graded coatings, anisotropic thin films/coatings, and other complex material systems. 

 

 Functionally Graded Material 

- a typical thin-coating

III.   Thermal Barrier Coating

  • Design optimization of pores coatings to protect gas turbine components from high temperature environments: coupled temperature-displacement, impact, and thermal fatigue analyses.
  • Micro mechanical and interface properties of thermal sprayed single splats.

 

IV.   Skills and Software

  • ANSYS: the most widely used FEA/CAE package 
  • ABAQUS: powerful FEA package specialize in nonlinear and explicit problems
  • SDRC-IDEAS: one of the most powerful design and modeling tool
  • Tecplot: one of the most powerful scientific plotting tools
  • SigmaPlot: very powerful and easy to learn
  • MS Word, PowerPoint, Excel, FrontPage
  • Maple: the most powerful symbolic calculation tool
  • Matlab: technical and mathematical computation

 

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