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Research |
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I. Electronics Packaging Aimed at understanding the failure mechanism by identifying likely fracture modes and potential delamination sites in flip chip packages. Multi-scale (global/local) finite element method were developed and applied. Detailed 2D and 3D fracture/fatigue analyses were carried out. |
Flip-Chip Packaging |
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II. Materials Characterization Inverse analysis procedures were developed based on micro/nano indentions and Kalman filter technique. Methods successfully applied to the characterization of metal-ceramic graded coatings, anisotropic thin films/coatings, and other complex material systems. |
Functionally Graded Material - a typical thin-coating |
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III. Thermal Barrier Coating
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IV. Skills and Software
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