Resume
Objective: A challenged mechanical engineering position in product design, development, and research.
Summary of Qualifications
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Six years of industry experience including mechanical engineer, stress analyst, and packaging engineer.
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Ten years of FEA experiences including static, dynamic, thermo-mechanical, creep, fatigue, drop, contact, fracture, heat transfer, and structural analyses.
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Ph.D. in Solid Mechanics with in-depth knowledge of microelectronics packaging, MEMS, thin film, and thermally sprayed coating.
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Expertise in DOE (design of experiment), drop test, and nano-indentation.
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Proficiency in FEA software ANSYS, ABAQUS, LS-Dyna, and APDL/macro.
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Proficiency in SDRC-IDEAS and comprehensive parametric modeling.
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Hand on experience on JMP, Fe-Safe, ProE, AutoCAD, and UNIX systems.
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Self-motivated, highly organized, good written and verbal communication skills.
You can download my detailed resume at here.
